华中科技大学机械科学与工程学院始建于1952年，是华中科技大学规模最大、实力最雄厚的学院之一，拥有中国科学院/工程院院士8人，机械工程一级学科在全国学科评估中连续获评A+，智能制造装备与技术全国重点实验室被连续评估为优秀类国家重点实验室。依托华中科技大学机械科学与工程学院全国重点实验室和相关的科研平台刘长清教授课题组拟向国内外公开招聘博士后科研人员2-3名。

一、课题组负责人介绍

现任华中科技大学机械科学与工程学院教授，博士生导师的英国拉夫堡大学荣休教授刘长清长期从事先进电子材料和制造技术的创新研究，包括半导体芯片器件异构集成，互连，封装及可靠性、互连界面特性及键合机理、电化学沉积互连凸点、功率电子及宽带半导体集成与封装、生物电子和智能可穿戴电子等相关的研究工作。迄今为止在相关领域国际材料及先进制造期刊及国际会议发表了300多篇相关学术论文。主持参与了若干科研项目并与世界各地包括帝国理工、伦敦大学国王学院、诺丁汉大学、曼彻斯特大学、新加坡南洋理工大学、香港城市大学等约30所院校、研究机构合作交流，指导了近40名博士生。他是美国电器电子工程师协会（IEEE）资深会员、曾任IEEE协会电子封装(EPS) 领域旗舰电子元件和技术国际会议（ECTC）的电子互连委员会主席，先后受聘于新加坡南洋理工大学、和香港城市大学(由英国皇家协会资助和任命)等国际知名大学的客座教授。

二、研究方向与内容

半导体元器件异构集成及制造技术：电子封装材料及制备；铜互连及其应用；电子互连界面特性、力学行为与可靠性； “绿色”可持续电子制造。

严酷服役条件下的电子互连材料及制造技术：高温互连材料，制造及应用；低温电子互连材料和制备；严酷环境下热-电-机械耦合可靠性分析及失效机理。

宽带半导体集成互连和热管理优化：功率电子宽带半导体先进互连材料与制程优化 (die-attach, substrate-attach)；高温扩散障、热界面材料制备及系统热管理优化。

生物及智能可穿戴电子异质集成技术：生物电子界面材料和制备；打印/柔性/有机电子相关材料及制造技术；电-生物-多材料多功能系统集成； 3D增材构建多功能复合仿生组织。

三、应聘条件

1.申请者年龄不超过35周岁，获得博士学位不超过3年，具有严谨的科研态度和良好的团队协作精神，符合华中科技大学博士后招聘条件http://postdoctor.hust.edu.cn/info/1007/2928.htm。

2.应聘者应具有与以上相关研究方向学科背景，包括先进电子材料与制造技术，集成电路及电子器件互连与封装，机械电子技术，电子信息工程等多学科交叉领域。具有较强的理论基础、实践能力、独立的科研能力，以及良好的团队合作精神。

3.具有较强的英语交流与写作能力，并能够积极参与实验室建设和研究生培养工作。

四、岗位待遇

1.博士后聘用期限为2年起，年薪32-42万，并享受各类成果奖励。

2.博士后在聘期内，参照学校在编在岗职工，享受子女入学入托、社会医疗保险以及其他社会保险等福利待遇；可申请入住博士后公寓；表现优秀者可竞聘教师岗位。

3.提供充足的科研经费和完善的实验条件，提供国际会议等交流机会，协助申报科研项目。

五、应聘材料及申请流程

1.个人中英文简历（包括个人基本信息、学习工作经历、科研项目参与情况、博士论文研究内容、论文发表情况等）

2.证明材料（博士学位证书扫描件或教育部学籍在线验证报告、学位论文首页以及不超过5篇代表作）

3.两封以上本学科领域高级职称专家推荐信。

4.博士后工作期间研究计划和预期目标。  

5.应聘者应将上述材料按顺序合并成1个PDF文件，发送到chenjia617@hust.edu.cn，邮件标题请注明：应聘博士后+本人姓名+博士后招聘网。

6.截止时间: 长年有效。

 

Postdoctoral Research Positions

Advanced Electronics Materials and Manufacturing

School of Mechanical Science and Engineering

Huazhong University of Science and Technology

Founded in 1952, the School of Mechanical Science and Engineering is one of the largest and strongest colleges in Huazhong University of Science and Technology(HUST), with 8 academicians of the Chinese Academy of Sciences/Academy of Engineering. Based on the National Key Laboratory at the School of Mechanical Science and Engineering of HUST and related scientific research platforms, Professor Liu Changqing's research group seeks to recruit 2-3 postdoctoral researchers in the areas of advanced electronics materials and manufacturing technology.

Professor Liu Changqing

Prof. Liu is a professor and doctoral supervisor at the School of Mechanical Science and Engineering at HUST in China, and an emeritus professor of Loughborough University in the United Kingdom. He has been extensively engaged in innovative research on advanced electronic materials and manufacturing technologies, including IC device heterogeneous integration, interconnection, packaging, interfacial characteristics and bonding mechanisms and reliability analysis; power electronics and Wide-band Gap (WBG) semiconductor integration and packaging; bioelectronics and intelligent wearable and implantable electronics. He has published more than 300 academic articles in international journals and conferences, and collaborated with over 30 universities and research institutions around the world, including Imperial College London, King's College London, University of Nottingham, University of Manchester, Nanyang Technological University of Singapore, City University of Hong Kong, etc., and his research work have attracted an extensive attention and recognition from his international peers, relevant organisations and industries.

Liu Changqing-School of Mechanical Science and Engineering (hust.edu.cn)

Description of Research Areas

Heterogeneous integration and packaging of semiconductor devices: electronic packaging materials and preparation; copper interconnection and its application; interface characteristics, mechanical behavior and reliability of electronic interconnection; "green" sustainable electronics manufacturing.

Electronic interconnect materials and manufacturing inharsh environments: high-temperature interconnect materials, manufacturing and application; low-temperature electronic interconnect materials and preparation; reliability analysis and failure mechanism in thermal-electric-mechanical coupled harsh environments.

Wide-band Gap (WBG) semiconductor integration、interconnect and thermal management optimization: Advanced Interconnect Materials (AIMs) and processes for die-attach, substrate-attach and optimization in power electronics; high-temperature diffusion barriers, thermal interface material fabrication; and system thermal management optimization.

Heterogeneous integration for bioelectronics and intelligent wearable electronics: bioelectronic interface materials and fabrication; printing/flexible/organic electronics related materials and manufacturing technologies; bio-electronic multi-material multifunctional system integration; 3D additive construction of multifunctional composite bionic tissues.

Requirements and Qualifications of Applicants

Applicants should be ideally under the age of 35, have obtained a doctorate degree for no more than 3 years, bearing a rigorous scientific research attitude and good teamwork spirit, see the further details via http://postdoctor.hust.edu.cn/info/1007/2928.htm

Candidates should have a suitable PhD degree in the related science and engineering subjects such as physics and chemistry, materials, and some research experience in electronic materials and manufacturing, Integrated Circuit and device integration and packaging, with a strong theoretical foundation, relevant practical skills, independent scientific research ability, and good team spirit.

Competent English communication and writing skills, being able to actively participate in the activities for set-up of the laboratory and supply relevant training to graduate students.

Terms and Conditions

The term of employment of postdoctoral fellows is 2 years, with an annual salary up to 350,000 Chinese Yuan.

During the employment period, postdoctoral fellows can enjoy welfare benefits such as children's enrollment in nurseries, social medical insurance and other social insurance, and can apply for a place in postdoctoral apartments.

The HUS will commit to the strongest supports to the successful candidates by providing sufficient research funds, an excellent research environment and development platform, offering opportunities of attending international conferences and other international research exchange, and helping for the research applications, and those with outstanding performance can be recommended for consideration of an offer of teaching position.

Procedures of Application

Curriculum vitae in Chinese and English including basic personal information, academic work experience, participation in scientific research projects, research content of doctoral dissertation, publication of dissertation, etc.

Supporting materials including scanned copy of doctoral degree certificate or online verification report of student status of the Ministry of Education, the first page of the dissertation and no more than 5 representative works).

Two or more letters of recommendation from experts with senior professional titles in the relevant subject field.

Research plan and expected goals during postdoctoral work.  

Applicants should put together the above materials into single PDF file and send via email: chenjia617@hust.edu.cn with the subject indicated as “Postdoctoral application + Applicant’s name”.

The dates and details of interview for shortlisted candidates will be arranged and notified separately.

Deadline: Positions are open to outstanding candidates all the year around.

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原文出处：

http://postdoctor.hust.edu.cn/info/1007/3322.htm

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